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| EMM5834X Datasheet, PDF (11/14 Pages) Eudyna Devices Inc – Ku / K-Band Power Amplifier MMIC | |||
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EMM5834X
Ku / K-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
VGG1
0 105 310
1380
1220
RF-IN 1075
VGG2 VGG3
1135 1265
VGG4
2250
2770 2880
1380
1220
1075 RF-OUT
110
110
0
0
0 105 230
930
2160
2770 2880
VDD1
VDD2
VDD3
VDD4
Chip Size : 2880±30um x 1380±30um
Chip Thickness : 60±20um
Bonding Pad Size : 80um x 80um(VDD, VGG), 160um x 80um (RF)
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