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| FMM5826X Datasheet, PDF (10/13 Pages) Eudyna Devices Inc – Ka-Band Power Amplifier MMIC | |||
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FMM5826X
Ka-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
1215
1110
VGG
0 135
600 910
1680
2200
2700 2805
1215
1110
RF-IN
695
RF-OUT
695
140
140
0
0
0 135
600 910
VDD1
1680
VDD2
2200
VDD3
2700 2805
Chip Size : 2805±30um x 1215±30um
Chip Thickness : 60±20um
Bonding Pad Size : 160um x 80um(RF, VGG), 80um x 80um (VDD)
10
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