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| FMM5820X Datasheet, PDF (10/13 Pages) Eudyna Devices Inc – Ka-Band Power Amplifier MMIC | |||
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FMM5820X
Ka-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
VGG1
0 275
VDD1
825
2620
2515
2485
VDD3
1685
VDD5
2345
VDD7
3875 4225
2620
2515
2485
1310
1310
135
105
0
0 275
825
(VGG2) VDD2
1685
VDD4
2345
VDD6
135
105
0
3875 4225
VDD8
Chip Size : 4225±30um x 2620±30um
Chip Thickness : 60±20um
Bonding Pad Size : 160um x 80um
NOTE: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2).
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