FTM1141GF Datasheet, PDF (1/5 Pages) Eudyna Devices Inc – Driver Integrated 10Gb/s MI-DFB LD Module

Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
FEATURES
• Driver integrated 10Gb/s MI-DFB module for 800ps/nm
optical transmission
• MI-DFB-LD (Modulator Integrated DFB Laser Diode) is included
• Modulator driver IC is included
• Built-in optical isolator, PIN-Photo diode for monitor, thermistor
and thermo-electric cooler
• 800ps/nm (40km)
DESCRIPTION
The FTM1141GF was developed to reduce the size and technical
complexity of 10Gb/s optical board designs. This product, which includes
a driver and modulator integrated laser in one package, eliminates the
customer concerns regarding how to handle the RF interfacing between
these two components on his board. By co-packaging these components
a solution has also been achieved that offers greatly reduced board space.
This reduction in space is critical for next generation transponder applications.
The FTM1141GF has been designed with a differential co-planar electrical interface
which allows for easy interfacing to RF lines on PC boards. The package and pinout are part of a
multi-source agreement. This product is designed for 40km SONET/SDM applications and single
channel drop links in DWDM systems.
ABSOLUTE MAXIMUM RATINGS (Top=25°C, Unless otherwise specified)
Parameter
Symbol
Condition
Rating
Min.
Max.
Unit
Storage Temperature
Tstg
-40
85
°C
Operating Case Temperature
Top(Tc)
0
75
°C
Optical Output Power
Pf
CW
-
5
mW
Laser Forward Current
If
CW
-
150
mA
Laser Reverse Voltage
VR
CW
-
2
V
Power Supply Voltage
VSS
-6.5
0.3
V
Modulator (Mod) modulation
Control Voltage
Vm
-6.5
VSS+1.2
(max0.3)
V
Mod Bias Control Voltage
Cross Point Control Voltage
Data Input Voltage
ESD Tolerance
Vb
Vx1,(Vx2)
Din, DinB
Vesd
Differential
(AC-coupled)
Note (1-1)
-6.5
VSS-4.8
(min-6.5)
-
-
VSS+2.4
(max0.3)
V
VSS+2.4
(max0.3)
V
1.6
Vpp
50
V
ESD Tolerance
Vesd
Note (1-2)
-
Photodiode Forward Current
IDF
-
Photodiode Reverse Voltage
VDR
-
TEC Voltage
Cooling
-
Vc
Heating
-2.5
TEC Current
Ic
Cooling
-
Heating
-0.9
200
V
1
mA
10
V
2.5
-
V
1.5
-
A
Thermistor Temperature
Tth
ATC operation
0
+75
°C
Lead Soldering Time
260°C MAX
-
10
sec
Edition 1.1
July 2004
1