EM68C08CWAE-18IH Datasheet, PDF (1/58 Pages) Etron Technology, Inc. – 128M x 8 bit DDRII Synchronous DRAM (SDRAM)

EtronTech
EM68C08CWAE
128M x 8 bit DDRII Synchronous DRAM (SDRAM)
Advanced (Rev. 1.1, Jul. /2014)
Features
• ^{JEDEC Standard Compliant}
• ^{JEDEC standard 1.8V I/O (SSTL_18-compatible)}
• ^{Power supplies: V}DD ^{& V}DDQ ^{= +1.8V ± 0.1V}
• ^{Industrial temperature: TC = -40~95°C}
• ^{Supports JEDEC clock jitter specification}
• ^{Fully synchronous operation}
• ^{Fast clock rate: 333/400/533 MHz}
• ^{Differential Clock, CK & CK#}
• ^{Bidirectional single/differential data strobe}
• ^{8 internal banks for concurrent operation}
• ^{4-bit prefetch architecture}
• ^{Internal pipeline architecture}
• ^{Precharge & active power down}
• ^{Programmable Mode & Extended Mode registers}
• ^{Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6}
• ^{WRITE latency = READ latency - 1 t}CK
• ^{Burst lengths: 4 or 8}
• ^{Burst type: Sequential / Interleave}
• ^{DLL enable/disable}
• ^{On-die termination (ODT)}
• ^{RoHS compliant}
• ^{Auto Refresh and Self Refresh}
• ^{8192 refresh cycles / 64ms}
- Average refresh period
7.8µs @ -40°C ÙTCÙ +85°C
3.9µs @ +85°C ÖTCÙ +95°C
• ^{60-ball 8 x 10 x 1.2mm (max) FBGA package}
- Pb and Halogen Free
Overview
The EM68C08C is a high-speed CMOS Double-
Data-Rate-Two (DDR2), synchronous dynamic random
- access memory (SDRAM) containing 1024 Mbits in a
8-bit wide data I/Os. It is internally configured as a 8-
bank DRAM, 8 banks x 16Mb addresses x 8 I/Os.
The device is designed to comply with DDR2 DRAM
key features such as posted CAS# with additive latency,
Write latency = Read latency -1 and On Die
Termination(ODT).
All of the control and address inputs are
synchronized with a pair of externally supplied
differential clocks. Inputs are latched at the cross point
of differential clocks (CK rising and CK# falling)
All I/Os are synchronized with a pair of bidirectional
strobes (DQS and DQS#) in a source synchronous
fashion. The address bus is used to convey row,
column, and bank address information in RAS #, CAS#
multiplexing style. Accesses begin with the registration
of a Bank Activate command, and then it is followed by
a Read or Write command. Read and write accesses to
the DDR2 SDRAM are 4 or 8-bit burst oriented;
accesses start at a selected location and continue for a
programmed number of locations in a programmed
sequence.
Operating the eight memory banks in an interleaved
fashion allows random access operation to occur at a
higher rate than is possible with standard DRAMs. An
auto precharge function may be enabled to provide a
self-timed row precharge that is initiated at the end of
the burst sequence. A sequential and gapless data rate
is possible depending on burst length, CAS latency,
and speed grade of the device.
Table 1. Ordering Information
Part Number
Clock Frequency Data Rate
EM68C08CWAE-18IH
533MHz
1066Mbps/pin
EM68C08CWAE-25IH
400MHz
800Mbps/pin
EM68C08CWAE-3IH
333MHz
667Mbps/pin
WA: indicates 8 x 10 x 1.2mm FBGA Package
E: indicates Generation Code
I: indicates Industrial Grade
H: indicates Pb and Halogen Free for FBGA Package
Power Supply
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
Package
FBGA
FBGA
FBGA
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: [phone] FAX: [phone]
Etron Technology, Inc. reserves the right to change products or specification without notice.