MC74VHC1G00 Datasheet, PDF (2/4 Pages) ON Semiconductor – 2-Input NAND Gate

MC74VHC1G00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V CC
V IN
V OUT
I IK
I OK
I OUT
I CC
T STG
TL
TJ
θ JA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC–70/SC–88A (Note 1)
TSOP–5
– 0.5 to + 7.0
– 0.5 to V CC + 0.5
– 0.5 to V CC + 0.5
± 20
± 20
± 12.5
± 25
– 65 to + 150
260
+ 150
150
200
V
V
V
mA
mA
mA
mA
°C
°C
°C
°C/W
PD
Power Dissipation in Still Air at 85C
SC–70/SC–88A
150
mW
TSOP–5
230
MSL
Moisture Sensitivity
Level 1
FR
V ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% – 35% UL 94 V–0 (0.125 in)
Human Body Model (Note 2)
>2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
I LATCH–UP
Latch–Up Performance Above V CC and Below GND at 85C (Note 5)
± 500
mA
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not
implied. Functional operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow.
2. Tested to EIA/JESD22–A114–A.
3. Tested to EIA/JESD22–A115–A.
4. Tested to JESD22–C101–A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
V CC
DC Supply Voltage
V IN
DC Input Voltage
V OUT
DC Output Voltage
TA
Operating Temperature Range
t r ,t f
Input Rise and Fall Time
V = 3.3 ± 0.3 V
CC
V = 5.0 ± 0.5 V
CC
Min
Max
Unit
2.0
5.5
V
0.0
5.5
V
0.0
V CC
V
– 55
+ 125
°C
0
100
ns/V
0
20
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Time,
Time,
Temperature °C
Hours
Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
VH0–2/4