RFM22B Datasheet, PDF (73/74 Pages) List of Unclassifed Manufacturers – ISM TRANSCEIVER MODULE

RFM22B/23B
Table 20. PCB Land Pattern Dimensions
Symbol
C1
C2
E
X1
X2
Y1
Y2
Millimeters
Min
Max
3.90
4.00
3.90
4.00
0.50 REF
0.20
0.30
2.65
2.75
0.65
0.75
2.65
2.75
Notes: General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
Note: Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
between the solder mask and the metal pad is to be 60 µm minimum,
all the way around the pad.
Notes: Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for
the perimeter pads.
4. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should
be used for the center ground pad.
Notes: Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for small body components.
73 Tel: [phone] Fax: [phone] E-mail: [e-mail]