YC164-JR-071KL Datasheet, PDF (7/8 Pages) List of Unclassifed Manufacturers – This specification describes YC164 (convex) and TC164 (concave) series chip resistor arrays with lead-free terminations made by thick film process.

Chip Resistor Surface Mount ^{YC/TC SERIES 164 (RoHS Compliant)}
Product specification 7
8
TEST
Solderability
- Wetting
TEST METHOD
PROCEDURE
IPC/JEDECJ-STD-002B test B
IEC 60068-2-58
Electrical Test not required
Magnification 50X
SMD conditions:
1^st step: method B, aging 4 hours at 155 °C
dry heat
2^nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
REQUIREMENTS
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds
IEC 60068-2-58
immersion time
- Resistance to
Soldering Heat
MIL-STD-202G-method 210F
IEC 60068-2-58
Condition B, no pre-heat of samples
Leadfree solder, 270 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
±(1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Oct 27, 2008 V.3
www.yageo.com