EFM32WG280 Datasheet, PDF (64/76 Pages) List of Unclassifed Manufacturers – The EFM32 MCUs are the world’s most energy friendly microcontrollers.

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3. Dimension 'D1' and 'E1' do not include mold protrusions. Allowable protrusion is 0.25 per side. Di-
mensions 'D1' and 'E1' do include mold mismatch and are determined at datum plane datum 'H'.
4. Dimension 'b' does not include dambar protrusion. Allowable dambar protrusion shall not cause the
lead width to exceed the maximum 'b' dimension by more than 0.08 mm. Dambar can not be located
on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm
5. Exact shape of each corner is optional.
Table 4.4. LQFP100 (Dimensions in mm)
total thickness
stand off
mold thickness
lead width (plating)
lead width
L/F thickness (plating)
lead thickness
x
y
x
body size
y
lead pitch
footprint
package edge tolerance
lead edge tolerance
coplanarity
lead offset
mold flatness
SYMBOL
MIN
A
--
A1
0.05
A2
1.35
b
0.17
b1
0.17
c
0.09
c1
0.09
D
E
D1
E1
e
L
0.45
L1
θ
0°
θ1
0°
θ2
11°
θ3
11°
R1
0.08
R1
0.08
S
0.2
aaa
bbb
ccc
ddd
eee
NOM
--
--
1.4
0.2
--
--
--
16 BSC
16 BSC
14 BSC
14 BSC
0.5 BSC
0.6
1 REF
3.5°
--
12°
12°
--
--
--
0.2
0.2
0.08
0.08
0.05
MAX
1.6
0.15
1.45
0.27
0.23
0.2
0.16
0.75
7°
--
13°
13°
--
0.2
--
The LQFP100 Package uses Nickel-Palladium-Gold preplated leadframe.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
2013-05-06 - EFM32WG280FXX - d0187_Rev1.10
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