FEDL2256X-08 Datasheet, PDF (63/67 Pages) List of Unclassifed Manufacturers – 4-Channel Mixing Speech Synthesis LSI with Built-in FLASH/MASK ROM

FEDL2256X-08
ML22Q563-NNN/ML22Q563-xxx/ML2256X-xxx
LIMITATION ON THE OPERATION TIME (PLAY-BACK TIME)
ML22Q563/ML22563’s operating temperature is 85℃. But the average ambient temperature at 1W play-back
(8ohm drive) during 10 years in the reliability design is Ta=55℃. (max ( the package heat resistance θ
ja=42.51[℃/W]) )
When ML22Q563/ML22563 operates 1W play-back(8ohm drive) consecutively, the product life changes by the
package temperature rise by the consumption. This limitation does not matter in the state that a speaker amplifier
does not play.
The factor to decide the operation time ( play-back time ) is the average ambient temperature( Ta ), play-back
Watts( at the speaker drive mode), the soldering area ratio*1, and so on. In addition, the limitation on the
operation time changes by the heat designs of the board.
PACKAGE HEAT RESISTANCE VALUE (REFERENCE VALUE)
The following table is the package heat resistance value θja (reference value).
This value changes the condition of the board (size, layer number, and so on)
The board
JEDEC 4layers
（W/L/t＝76.2/114.5/1.6（mm））
JEDEC 2layers
（W/L/t＝76.2/114.5/1.6（mm））
θja
42.51[℃/W]
55.37[℃/W]
The condition
No wind (0m/sec)
the soldering area ratio*¹ï¼š100%
*1 : The soldering area ratio is the ratio that the heat sink area of ML22Q563/ML22563 and a land pattern on
the board are soldered. 100% mean that the heat sink area of ML22Q563/ML22563 is completely soldered
to the land pattern on the board. About the land pattern on the board, be sure to refer to the next clause
(PACKAGE DIMENSIONS).
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