MLX90242_04 Datasheet, PDF (6/7 Pages) List of Unclassifed Manufacturers – Linear Hall Effect Sensor

MLX90242
Linear Hall Effect Sensor
10. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
11. Package Information
1.60
1.40
0.84
4.30
0.63
3.90
2.64
2.34
0.48
0.43
0.7 Max
0.20
0.00
42GA ^*
2053
45^o
Typical
3.20
2.80
1.75
1.55
UA Package Dimensions
Typ 5^o
Max 5^o
Max 5 ^o
0.38
Typical
(see note 3)
0.41
0.35
NOTES:
1.) Controlling dimension: mm
15.0
1 2 3 2.) Leads must be free of flash and
14.0
plating voids
3.) Leads must not arc toward
the rear of package
4.) Package dimensions exclude
molding flash
5.) Tolerance is 0.254mm unless
otherwise specified
1.30
1.24
2.57
0.41
2.51
0.35
UA Hall Plate / Chip Location
1.95 +/- 0.15
0.45
Hall Plate dimension:
0.41
0.150x0.150
Marked
Surface
All Dimensions in millimeters
* MARKING:
Line 1:
1st and 2nd digits (42) = Part Number MLX90242
3rd and 4th digits (GA) = Version number
Line 2:
1st digit (2)
2nd and 3rd digits(05)
4th digit (3)
= Year (2002)
= Week of Year
= Last Lotnumber Digit
PINOUT:
Pin 1
Pin 2
Pin 3
V_DD
GND (Vss)
Output
SOT-23 Package Dimensions
0.50
0.35
3
42951 ^3.00
*
2.60
1.80
1.50
1
2
2.10
1.70
0.20
MIN
chip
0.66
0.56
0.25
0.10
3.10
2.70
0.10
0.00
0.90
1.30
0.70
1.00
* MARKING:
SOT-23 Hall Plate / Chip Location
1&2 Digits (42) = Part Number (90242)
Bottom View of Package
3,4&5 Dgits(951) =Last Lotnumber Digits
NOTES:
1.) Controlling dimension: mm
PINOUT:
Pin 1
Pin 2
Pin 3
V_DD
Outpout
GND
0 +/- 0.15
2.) Lead thickness after solder plating will
be 0.254 mm maximum
3.) Package dimensions exclude molding
flash
4.) The end flash shall not exceed 0.127 mm
on each side of package
5.) Tolerance is 0.254mm unless otherwise
specified
3
MLX90242
2
1
3901090242
Rev. 024
Page 6 of 7
Data Sheet
Mar/04