MKP375 Datasheet, PDF (48/54 Pages) List of Unclassifed Manufacturers – AC and Pulse

BCcomponents
AC and Pulse
metallized polypropylene film capacitors
Product specification
KP/MKP 375
Heat conductivity (G) as a function of pitch and capacitor body thickness in mW/°C
Table 1 Heat conductivity
b_max
(mm)
10
ORIGINAL PITCH
(mm)
15
22.5
27.5
4.0
4.0
5.0
−
−
4.5
4.5
6.0
−
−
5.0
5.0
6.0
12.0
13.0
5.5
6.0
6.5
13.0
15.0
6.0
6.0
6.5
13.0
15.0
6.5
6.5
8.0
15.0
17.0
7.0
−
8.0
15.0
17.0
7.5
−
9.0
17.0
18.0
8.0
−
9.0
17.0
20.0
8.5
−
11.0
18.0
20.0
9.0
−
11.0
18.0
22.0
9.5
−
12.0
20.0
22.0
10.0
−
12.0
20.0
23.0
10.5
−
−
22.0
25.0
11.0
−
−
−
25.0
11.5
−
−
−
27.0
12.0
−
−
−
27.0
12.5
−
−
−
30.0
13.0
−
−
−
30.0
13.5
−
−
−
30.0
14.0
−
−
−
30.0
14.5
−
−
−
33.0
15.0
−
−
−
33.0
15.5
−
−
−
37.0
16.0
−
−
−
37.0
Power dissipation and maximum component temperature rise
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a
function of the free air ambient temperature.
The power dissipation can be calculated according chapter “Introduction”, section “Maximum power dissipation”.
The component temperature rise (∆T) can be measured (see section “Measuring the component temperature” for more
details) or calculated by ∆T = P ⁄ G :
• ∆T = component temperature rise (°C).
• P = power dissipation of the component (mW).
• G = heat conductivity of the component (mW/°C).
2000 Feb 01
48