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ZSSC3036 Datasheet, PDF (47/49 Pages) List of Unclassifed Manufacturers – Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner | |||
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ZSSC3036
Low-Power 16-Bit Sensor Signal Conditioner IC
6 Ordering Sales Codes
Sales Code
Description
ZSSC3036CC1B Dieâtemperature range: â40°C to +85 °C
ZSSC3036CC6B Dieâtemperature range: â40°C to +85 °C
ZSSC3036CI1B Dieâtemperature range: â40°C to +85 °C, extended qualification
ZSSC3036CI6B Dieâtemperature range: â40°C to +85 °C, extended qualification
ZSSC3036CC1C Dieâtemperature range: â40°C to +85°C
ZSSC3036CC1D Dieâtemperature range: â40°C to +85°C
ZSSC3036CI1C Dieâtemperature range: â40°C to +85°C, extended qualification
ZSSC3036CI1D Dieâtemperature range: â40°C to +85°C, extended qualification
ZSSC3036CI1BH Dieâtemperature range: â40°C to +110 °C, 1 extended qualification
ZSSC3036CI6BH Dieâtemperature range: â40°C to +110 °C, extended qualification
ZSSC3036CI1CH Dieâtemperature range: â40°C to +110 °C, extended qualification
ZSSC30x6-KIT
Evaluation Kit for ZSSC30x6 Product Family, including boards, cable,
software, and 1 sample
Contact ZMDI Sales for additional information.
Package
Wafer (304µm) unsawn, tested
Wafer (725µm) unsawn, tested
Wafer (304µm) unsawn, tested
Wafer (725µm) unsawn, tested
Dice on frame (304µm), tested
Waffle pack (304µm), tested
Dice on frame (304µm), tested
Waffle pack (304µm), tested
Wafer (304µm) unsawn, tested
Wafer (725µm) unsawn, tested
Dice on frame (304µm), tested
Kit
7 Related Documents
Document
ZSSC3036 Feature Sheet
ZSSC3036 Application Note: Application Circuits
ZSSC30x6 Evaluation Kit Documentation
ZSSC30x6 Application Note: Calibration
File Name
ZSSC3036_FeatureSheet_v*.pdf
ZSSC3036_ApplicationCircuit_v*.pdf
ZSSC30x6_EvaluationKit_v*.pdf
ZSSC30x6_Calibration_v*.pdf
Visit ZMDIâs website www.zmdi.com or contact your nearest sales office for ordering information or the latest
version of these documents.
Data Sheet
May 28, 2013
© 2013 Zentrum Mikroelektronik Dresden AG â Rev. 1.20
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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