R223424000 Datasheet, PDF (3/5 Pages) List of Unclassifed Manufacturers – SMTJACK RECEPTACLE

TECHNICAL DATA SHEET
SMTJACK RECEPTACLE
-
3/5
R223.424.000
Series : MMBX
1. Deposit solder paste ‘SnAg4Cu0.5’ on mounting zone by screen printing application. We recommend a low residue
flux.
We advise a thickness of 150 micromm ( 5.850 microinch ). Verify that the edges of the zone are clean.
2. Placement of the receptacle on the mounting zone with an automatic machine of ‘pick and place’ type.
A video camera is recommended for positioning of the component.
Adhesive agents must not be used on the receptacle.
3. This process of soldering has been tested with convection oven.
Below please find, the typical profile to use.
4. The cleaning of printed circuit boards is not obliged.
5. Verification of solder joints and position of the component by visual inspection.
TEMPERATURE PROFILE
Parameter
Temperature rising Area
Max Peak Temperature
Max dwell time @260°C
Min dwell time @235°C
Max dwell time @235°C
Temperature drop in cooling Area
Max dwell time above 100°C
Value
1 -4
260
10
20
60
-1 to - 4
420
Unit
°C/sec
°C
sec
sec
sec
°C/sec
sec
Issue : 0736 B
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.