OARSXPR002FLF Datasheet, PDF (3/5 Pages) List of Unclassifed Manufacturers – Surface Mount Sense Resistors

Surface Mount
Sense Resistors
OARS, OARS-XP, OARSZ Series
Thermal Performance Examples
OARS1-R005 at 2W
OARSXP-R0025 at 5W
These thermal images were taken under ambient conditions of still air at 25°C with the components
mounted on horizontal standard test boards as defined below.
JEDEC standard circuit board:
2” (50.8mm) square FR4
2 outer power planes, 2 ounce (70μ) Cu
1” (25.4mm) square exposed
2 inner signal planes, 1 ounce (35μ) Cu
(continuous planes)
In contrast to the flat chip format, the OARS format keeps the hot spot thermally distant from the
solder j oints and reduces undesirable heat delivery into the PCB. Further thermal images for other
ohmic values and power dissipations are available on request.
Kelvin (4 Terminal) Mounting
For high precision applications a Kelvin (4
Terminal) mounting method is
recommended. An example to illustrate the
design principle is shown. High current
connections are made to the two pairs of
larger pads, whilst the voltage sense
connections are made to the two smaller
central pads.
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
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