ANT-245-CHP Datasheet, PDF (3/4 Pages) List of Unclassifed Manufacturers – 2.45GHz ULTRA COMPACT CHIP ANTENNA DATA GUIDE

SOLDERING CONSIDERATIONS
Hand Soldering
This antenna is designed for high-volume automated assembly, however, it may be
successfully attached by hand assembly techniques. A hand-solder temperature of
225° or lower should be used. Do not exceed a 10 sec. heating time.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
process. The reflow profile below should be closely followed since excessive
temperatures or transport times during reflow will irreparably damage the antennas.
Assembly personnel will need to pay careful attention to the oven's profile to insure
that it meets the requirements necessary to successfully reflow all components while
still meeting the limits mandated by the antennas themselves.
REFLOW SOLDERING PROFILE
230°C
200°C
150°C
preheating
100sec max
soldering
10sec max
cooling
60sec min
60sec min
20sec min
FLOW SOLDERING PROFILE
235¡ C
preheating
100sec
dipping
2 ±0.5sec
cooling
60sec min
150¡ C
60sec min
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