MLX90316_05 Datasheet, PDF (28/34 Pages) List of Unclassifed Manufacturers – Rotary Position Sensor IC

MLX90316
Rotary Position Sensor IC
18. Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
• Melexis Working Instruction 341901308
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
• Melexis Working Instruction 341901309
Iron Soldering THD’s (Through Hole Devices)
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
• Melexis Working Instruction 341901309
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
• Melexis Working Instruction 3304312
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board.
For more information on the lead free topic please see quality page at our website:
http://www.melexis.com/quality.asp
19. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901090316
Rev. 001
Page 28 of 34
Data Sheet
4 October 05