S8230 Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – Mainstream dual-socket server platform for enterprise applications

S8230
S8230WGM4NR/S8230GM4NR/ S8230WGM4NR-LE/ S8230GM4NR-LE
Specifications
Processor
Chipset
Memory
Expansion
Slots
Recommended
Barebone /
Chassis
LAN
Storage
Graphic
Input /Output
System
Monitoring
Supported CPU Series AMD Opteron™ 6100/6200 series processors
Socket Type / Q'ty
G34 / (2)
Average CPU Power
(ACP) wattage
Up to 105W
System Bus
Support (4) HyperTransport™ 3.0 link, max.
bandwidth up to 25.6 GB/s @ 6.4GT/s per
link
Chipset
AMD SR5690 + SP5100
AMD SR5670 + SP5100 (-LE SKUs)
Super I/O
Winbond W83627DHG-P
Supported DIMM Qty (8+8) DIMM slots
DIMM Type / Speed U/RDDR3 & LV DDR3, 1333/1066/800MHz
Capacity
Up to 256GB
Memory channel
8 Channels (4 Channels per CPU)
Memory voltage
1.5V/ 1.35V
PCI-E
(1) PCI-E Gen.2 x16 slot (w/ x16 or x8 link)
(1) PCI-E Gen.2 x8 slot (w/ x0 or x8 link)
(1) PCI-E Gen.2 x8 slot (w/ x4 link)
(S8230WGM4NR/ S8230GM4NR only)
(1) PCI-E Gen.2 x8 slot (S8230WGM4NR/
S8230GM4NR only)
Recommended TYAN^®
Riser Card
M2091, PCI-E x16 1U riser card (left)
PCI
(2) PCI 32/33MHz slots
1U Barebone
GT62-B8230-LE
Port Q'ty
Controller
Connector
SAS Controller
(opt.) _Speed
RAID
Connector
Controller
SATA
Speed
RAID
Connector type
Resolution
Chipset
USB
COM
PS/2
SAS
VGA
RJ-45
Power
Front Panel
SATA
Chipset
Voltage
Fan
Temperature
Others
(4)
Intel® 82576EB
Intel^® 82574L
(8)
LSI SAS2008
6.0 Gb/s
RAID 0/1/1E/10 (LSI Integrated RAID)
(1)
AMD SP5100
3.0 Gb/s
RAID 0/1/10/5 (Promise RAID Stack)
D-Sub 15-pin
1600x1200@60Hz
Aspeed AST2050
(6) USB2.0 ports (2 at rear, 2 via cable, 2
type A onboard)
(2) ports (1 at rear, 1 via cable)
(1) PS/2 connector
(2) Mini-SAS (4-in-1) connectors
(1) D-Sub 15-pin VGA port
(4) GbE ports
Universal 24-pin + 8-pin + 8-pin power
connectors
(1) 2x12 pin SSI front panel header
(6) SATA-II connectors
Winbond W83795G
Monitors voltage for CPU, memory, chipset &
power supply
Total (7) 4-pin headers
Monitors temperature for CPU & system
environment
Chassis intrusion detection
Watchdog timer support
Block Diagram
DDR3 P1_MD1
DDR3 P0_MD1
DDR3 P1_MC1
DDR3 P0_MC1
DDR3 P1_MD0
DDR3 P0_MD0
RDIMM/UDIMM/LVDIMM
DDR3 P1_MC0
DDR3 SDRAM
Interface
Channel A
DDR3 SDRAM
Interface
Channel B
DDR3 P0_MC0
RDIMM/UDIMM/LVDIMM
DDR3
SDRAM
Interface
16 ×16 Hyper
Transport
DDR3
SDRAM
Interface
DDR3 SDRAM
Interface
Channel A
DDR3 SDRAM
Interface
Channel B
16 ×16 Hyper
PCI-X 64/133
SAS x8
GBLAN RJ45
GBLAN RJ45
GBLAN RJ45
LSI PCI-Express ×8
SAS2008
Intel 82574 PCI-Express ×4
Dual Port
Single Port ^{PCI-Express ×1}
Intel 82574 _{PCI-Express ×1}
total: 2
PCI-E x8
PCI-E x16 (x16 slot)
SR5690/ ^{PCI-E x8}
SR5670(LE) ^{PCI-E x8}
PCI-E x8
PCI-E x8
Mux for PCI-E x8
PCI-E x8 (x8 slot)
PCI-E x4
PCI-E x4 (x8 slot)
GBLAN RJ45
PCI
32/33
A link PCI-Express ×4
SR5100
USB x 6
SATA x 6
VGA & BMC
AST2050
LPC
Super IO
Winbond83627
DHG-P
TPM
COM1
COM2
Server
Management
BIOS
Form Factor
Operating
System
Regulation
Operating
Environment
RoHS
Onboard Chipset
Onboard Aspeed AST2050
AST2050 IPMI Feature
IPMI 2.0 compliant baseboard management
controller (BMC)
BIOS update
USB 2.0 virtual hub
AST2050
iKVM Feature
24-bit high quality video compression
Dual 10/100 Mb/s MAC interfaces
Brand / ROM size
AMI / 4MB
Feature
Form Factor
Board Dimension
Plug and Play (PnP)/ PCI 2.3
WfM2.0 / SMBIOS2.3 / PXE boot
ACPI 2.0 power management
Power on mode after power recovery
User-configurable H/W monitoring
Auto-configurable of hard disk types
Multiple boot options
EATX
12"x13" (305x330mm)
OS supported list
Please refer to our OS supported list.
FCC (DoC)
CE (DoC)
Operating Temp.
Non-operating Temp.
In/Non-operating
Humidity
RoHS 6/6 Complaint
Class B
Yes
10° C ~ 35° C (50° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F)
90%, non-condensing at 35° C
Yes
(Specifications are subject to change without notice. Items pictured may only be
representative.)
MITAC INTERNATIONAL CORP.
TYAN Business Unit
USA
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Japan
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Europe
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China
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