S7067 Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – DUAL-SOCKET RACK-OPTIMIZED RACK-OPTIMIZED

S7067
S7067WGM3NR-2T / S7067GM3NR-2T
Specifications
Processor
Chipset
Memory
Expansion
Slots
LAN
Supported CPU Series
Socket Type / Q'ty
Thermal Design
Power (TDP) wattage
PCH / PCI-E Switch
Super I/O
Supported DIMM Qty
Intel Xeon Processor E5-2600/E5-2600 v2 Series
LGA2011 / (2)
Max up to 130W
Intel^® C602 series
-
(8+8) DIMM sockets
DIMM Type / Speed
UDIMM/RDIMM/LRDIMM ECC 1066/1333/1600/1866
*Speed 1866 only for 1 slot per channel 1.5V(Blue
color DIMM slot )
Capacity
up to 128GB UDIMM / 256GB RDIMM / 512GB LRDIMM
Memory channel
4 Channels
Memory voltage
1.35V/1.5V
PCI-E
Recommended TYAN^®
Riser Card
PCI
(1) sets of the f ollowing expansion
combination: (1) PCI-E x8 slot
-
Port Q'ty
(1)GbE port shared with IPMI
Controller
Intel^® 82574L
10GbE LAN
Port Q'ty
Controller
Connector type
(2)
Broadcom 57810S
SFP+
Storage
SAS
(opt.)
SATA
Connector
Controller
Speed
RAID
Connector
Controller
Speed
Graphic
Audio
TPM (optional)
RAID
Connector type
Resolution
Chipset
Chipset
Version
Chipset
Version
USB
Input /Output
COM
Audio
VGA
DVI
Display Port
Power
RJ-45
SAS
Front Panel
SATA
SFP+
(8) SAS (S7067WGM3NR-2T SKU)
LSI SAS2308
6.0 Gb/s (mini-SAS connector)
RAID 0/1/10
(6) SATA (S7067GM3NR-2T SKU)
Intel^® C602
(2) 6.0 Gb/s(blue color); (4) 3.0 Gb/s (mini-
SAS connectors)
RAID 0/1/10/5 (Intel^® RST)
D-Sub 15-pin
up to 1920 x 1200
Aspeed AST2300
-
-
Winbond
WPCT200AAOWG
(5) USB2.0 ports (2 at rear, 2 v ia cable, 1
ty pe A onboard)
(1) header (1) port (rear)
-
(1) D-Sub 15-pin VGA port
-
-
SSI 24-pin + 8-pin + 8-pin power connectors
(1) GbE ports
(2) Mini-SAS (4-in-1) connectors
(1) 2x12-pin SSI f ront panel header
(1) Mini-SAS connector
(2) SATA II connectors
(2) 10GbE Ports
BBlolocckkDDiiaaggrraamm
SAS0-3
SAS4-7
DDR3
channel A/B
DDR3
channel E/F
SAS2
PCI Express x8
LSI SAS2308
DDR3
channel C/D
PCIE Gen3
PCIE Gen3
IVY
Bridge-EP
QPI Port 0
(8.0GT/s)
QPI Port 1
(8.0GT/s)
IVY
Bridge-EP
DDR3
channel G/H
PCIE 8x
BCM57810S
(1OGbE)
SATA2
SATA2-5
SFP+
SFP+
TPM
Winbond
WPCT200AA0WG
LPC Interface
Intel 82574
1GB LAN
PCIE Gen2
Intel
Patsburg
PCH
SKU -A
SATA3
SATA0
SATA1
USB 2.0 Front USB0-1
Rear USB8-9
TYPE A USB
NC SI Interface
Frame Buffer Memory
COM1
BMC 128Mb SPI ROM
SYSTEM 64Mb SPI ROM
DDR III
UART
SPI lnterface
SPI lnterface
ASpeed IRMP
AST2300
RGB
D-Sub
HWM-FAN
CPU0
CPU1
FRONT1 FRONT2 FRONT3
REAR1 REAR2
System
Monitoring
Chipset
Voltage
Fan
Aspeed AST2300
Monitors v oltage f or CPU, memory ,
chipset & power supply
Total (5) 4-pin headers
Temperature
Monitors temperature for CPU & memory
Server
Management
BIOS
Form Factor
Operating
System
Regulation
Operating
Environment
RoHS
Onboard Chipset
Onboard Aspeed AST2300
IPMI 2.0 compliant baseboard management
controller (BMC)
AST2300 IPMI Feature Supports storage ov er IP and remote
platf orm-f lash
USB 2.0 v irtual hub
AST2300 iKVM Feature
24-bit high quality v ideo compression
10/100 Mb/s MAC interf ace
Brand / ROM size
AMI / 8MB
Feature
Form Factor
Board Dimension
Plug and Play (PnP) /PCI2.3 /Wf M2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management /Power on mode af ter power
recov ery / User-conf igurable H/W
monitoring / Auto-conf igurable of hard disk
ty pes
EATX
12"x13" (305x330mm)
OS supported list
Please ref er to our OS supported list.
FCC (DoC)
Class A
CE (DoC)
Y es
Operating Temp.
10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
In/Non-operating
Humidity
90%, non-condensing at 35° C
Non-operating Relativ e Humidity : 10% to
95% (non-condensing)
RoHS 6/6 Complaint Y es
(Specifications are subject to change without notice. Items pictured may only be representative.)
MITAC INTERNATIONAL CORP.
TYAN Business Unit
USA
Tel: [phone]
Fax: [phone]
Taiwan
Tel: [phone]
Fax: [phone]
Japan
Tel: [phone]
Fax: [phone]
Europe
Sales: [phone]
Technical Support: [phone]
China
Shanghai Tel: [phone] Ext 1366
China Tel:-86-010-62555015 Ext 8302