N55S064 Datasheet, PDF (2/17 Pages) List of Unclassifed Manufacturers – 64M-BIT Low Voltage, Serial MASK ROM

PHYSICAL SPECIFICATIONS
Chip Size: 4326.0 x 4860.0 (um)
Pad Size: 76 x 76 (um)
Die Thickness: 725 ±15 (um)
FIGURE 1. DIE PAD LOCATIONS
N55S064
NOTE:
1. The IC substrate should be connected to VSS in PCB layout.
2
REV. 1.1, MAR., 2010