CD2015FC Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – Low Resistance Precision Chip Resistors

Type CD Low Resistance Precision Chip Resistors
Page 2 of 2
Style WB - Wire Bond Version is a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire
bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate.
Model
CD2015WBA
CD2520WBA
Resistance
Min.
0.010 Ω
0.010 Ω
Max.
0.20 Ω
0.20 Ω
Power Capability Information
Thermal Resistance
R_θJC
Film (J) to Solder Pad (C)
(see note 3)
Max. Chip
Temperature
8.33°C/Watt
150°C
5.00°C/Watt
150°C
Dimensions in inches and (millimeters)
A
.200 ±.012
(5.08 ±.30)
.250 ±.012
(6.35 ±.30)
B
.150 ±.012
(3.81 ±.30)
.200 ±.012
(5.08 ±.30)
C
.061 ±.005
(1.55 ±.13)
.061 ±.005
(1.55 ±.13)
D
.062 min.
(1.57 min.)
.078 min.
(1.98 min.)
Comments
Terminals have an Aluminum surface layer for
wire bonding. Aluminum wire to be used for bonding.
Terminals have an Aluminum surface layer for
wire bonding. Aluminum wire to be used for bonding.
Note 3: Thermal Resistance - In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and the
solder pad temperature is measured at the soldered interface with the circuit board. Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the
temperature range of the application.
CD2015WBA
Standard Resistance Values:
Tolerance CD2015WBA ±1% Standard.
0.010 Ω
0.015 Ω
0.020 Ω
0.025 Ω
0.030 Ω
0.033 Ω
0.040 Ω
0.050 Ω
0.075 Ω
0.10 Ω
0.20 Ω
Location for Sense (Potential) Connection:
Note: The sense connection for each
pedestal is positioned inboard of the current
connection (single or multiple current wires).
Sense Wire
Current Wire
Film Temperature
Measuring Point
Sense Wire
Current Wire
Solder pad, soldered
interface with circuit board.
Circuit board: IMS, Ceramic (Alumina) , or other.
WB Resistor mounting
CD2520WBA
Standard Resistance Values:
Tolerance CD2520WBA ±1% Standard.
0.010 Ω
0.015 Ω
0.020 Ω
0.025 Ω
0.030 Ω
0.033 Ω
0.040 Ω
0.050 Ω
0.075 Ω
0.10 Ω
0.20 Ω
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
General Information for Type CD - Style FC and Style WB - Chip Resistors
Specifications:
Temperature Coefficient: TC referenced to
+25°C, ΔR taken at +150°C.
0.050 ohm to 0.20 ohm, 0 to +100 ppm/°C.
0.010 ohm to 0.049 ohm, 0 to +200 ppm/°C.
Inductance: Less than 5 nH typical.
Load Life: 1000 hours at rated power, based
upon 150°C max. chip temperature,
ΔR ± (0.5% + 0.0005 ohm).
Momentary Overload: 1.5 times rated
power, for 5 seconds, ΔR ± (0.5% + 0.0005
ohm).
Operating Temperature: -55°C to +150°C.
Measurement Note: All measurements
are taken using Kelvin connections per the
recommended connection locations.
A
D
B
C
Dimensions in inches and (millimeters)
Solder attachment notes:
During soldering of the Type CD Resistor
the soldering temperature profile must not
cause the pedestal terminals of this device
to exceed 220°C.
Style FC - Flip Chip version resistors
have a bare ceramic back surface. The
recommended solder for flip chip solder
attachment is 62Sn / 36Pb / 2Ag.
Style WB - Wire Bond version resistors
have a metallized back surface for
soldering to a substrate or a heat sink.
The recommended solder is
62Sn / 36Pb / 2Ag.
Ordering
Information:
Physical Size
2015 = 0.200” x 0.150”
2520 = 0.250” x 0.200”
CD 2520 FC - 0.10 - 1%
Type CD
Style:
FC or WBA
Resistor Value (Ω)
See charts for availability
Tolerance:
±1% 0.010 Ω and above.
Packaging information:
Style FC, flip chip resistors, are shipped with the bare
ceramic side up in the pocket, with the solderable pedestals
facing down.
Style WB, wire bondable resistors, are shipped with the
wire bondable pedestals facing up in the pocket.
The illustration shows the orientation of the CD2015 chip
resistors in the tape. The CD2520 chip resistors are rotated 90°
from what is shown in the illustration.
7” dia.
(178 mm)
12mm
0.473”
Bo
Ao
Ko signifies tape thickness and dimension
.512” arbor hole
(13mm)
Size 2015
Size 2520
Ao 0.189” (4.80mm) 0.271” (6.88mm)
Bo 0.209” (5.31mm) 0.216” (5.49mm)
Ko 0.087” (2.21mm) 0.066” (1.68mm)
Carrier Tape and pocket dimensions:
Tape is 12mm Carrier Tape (8mm pitch)
Full reel quantities:
1000 pieces per reel for CD2015 and CD2520
Quantities of less than 250 will be shipped in tape without reel
and without tape leader at the option of Caddock.
Tape dimensions and materials will be consistent with EIA-481-1.
Reels will be marked with a label containing Caddock logo, part
number, resistor value, tolerance, packaging date, and quantity.
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: [phone]
Fax: [phone]
© 2004 Caddock Electronics, Inc.
CADDOCK
e-mail: [e-mail] • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: [phone]
Fax: [phone]
28_IL107.1004