SI4824-DEMO Datasheet, PDF (16/20 Pages) List of Unclassifed Manufacturers – BROADCAST MECHANICAL TUNING AM/FM/SW RADIO RECEIVER

Si4820/24-A10
8. PCB Land Pattern: Si4820/24-A10
Figure 4, “PCB Land Pattern,” illustrates the PCB land pattern details for the Si4820/24-A10-CU SSOP. Table 11
lists the values for the dimensions shown in the illustration.
Figure 4. PCB Land Pattern
Table 11. PCB Land Pattern Dimensions
Dimension
Min
Max
C
5.20
5.40
E
0.635 BSC
X1
0.35
0.45
Y1
1.55
1.75
General:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
Solder Mask Design:
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design:
4. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
Card Assembly:
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
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Rev. 1.0