TS30013 Datasheet, PDF (15/18 Pages) List of Unclassifed Manufacturers – High Efficiency 1A/2A/3A Current-Mode Synchronous Buck DC/DC Converter, 1MHz

TS30011/12/13
Version 1.6
hi-K JEDEC board and 13.5 square inch of 1 oz Cu, the thermal resistance from junction to ambient can be reduced to JA =
38°C/W. The power dissipation of other power components (catch diode, inductor) cause additional copper heating and can
further increase what the TS30011/12/13 sees as ambient temperature.
PACKAGE MECHANICAL DRAWINGS (all dimensions in mm)
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Units
Dimensions Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Length
D
Exposed Pad Width
E2
Overall Width
E
Exposed Pad Length
D2
Contact Width
b
Contact Length
L
Contact-to-Exposed Pad
K
MILLIMETERS
MIN NOM MAX
16
0.50 BSC
0.80
0.90
1.00
0.00
0.02
0.05
0.20 REF
3.00 BSC
1.55
1.70
1.80
3.00 BSC
1.55
1.70
1.80
0.20
0.25
0.30
0.20
0.30
0.40
0.20
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Specifications subject to change
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