SHT3X-DIS Datasheet, PDF (15/18 Pages) List of Unclassifed Manufacturers – Very fast start-up and measurement time

Datasheet SHT3x-DIS
land pattern
0.3x45°
sensor outline
stencil aperture
0.2
0.55
1
0.75
0.3
0.55 0.55 0.9
0.8
Figure 12 Recommended metal land pattern (left) and stencil apertures (right) for the SHT3x-DIS. The dashed lines represent
the outer dimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded
areas.
6 Shipping Package
0.30 ±.05
2.00 ±.05 SEE Note 2
4.00 SEE Note 1
Ø1.5 +.1 /-0.0
4.00
Ø1.00 MIN
1.75 ±.1
A
R 0.2 MAX.
B₀
K₀
A₀
R 0.25 TYP.
5.50 ±.05
SEE NOTE 2
B
12.0 +0.3/-0.1
A
SECTION A - A
A₀ = 2.75
B₀ = 2.75
K₀ = 1.20
TOLERANCES - UNLESS
NOTED 1PL ±.2 2PL ±.10
NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"
ABOVE THE BOTTOM OF THE POCKET
DETAIL B
Figure 13 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to
the left on this drawing. Dimensions are given in millimeters.
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October 2015 - Version 1
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