TS30111 Datasheet, PDF (13/23 Pages) List of Unclassifed Manufacturers – High Efficiency 700mA Current-Mode Synchronous Buck DC/DC Converter, 1MHz

TS30111
Version 1.0
The exposed thermal pad must be soldered to the PCB for mechanical reliability and to achieve good power dissipation. Vias
must be placed under the pad to transfer the heat to the ground plane.
VOUT
C_OUT
C_OUT
L_OUT
Switching
node
Vias to
ground
plane
D_CATCH
C_BYP
C_BYPASS
VSW
VCC
VCC
GND
VSW
VCC
BST
EN
R_PLP
R_BOT
R_TOP
PGND
VCC
Analog
ground
(GND)
Vias to
ground
plane
Figure 21: TS30111 PCB Layout, Top View
EXTERNAL COMPONENT BILL OF MATERIALS
Designator Function
Description
Suggested
Manufacturer
Manufacturer Code
Qty
C_BYPASS
Input Supply Bypass
Capacitor
10uF 10%
35V
TDK
CGA5L3X5R1V106K160AB
1
C_OUT
Output Filter Capacitor
22uF 10%
10V
TDK
C2012X5R1A226K125AB
1
L_OUT
Output Filter Inductor
3.3uH 900mA
TDK
Wurth
MLP2012S3R3MT
744045003
1
C_BST
Boost Capacitor
22nF 10V
TDK
C1005X7R1C223K
1
R_TOP
Voltage Feedback Resistor
(optional)
17.8K
(Note 1)
1
R_BOT
Voltage Feedback Resistor
(optional)
10K
(Note 1)
1
R_PLP
PG Pin Pull-up Resistor
(optional)
10K
1
D_CATCH
Catch Diode (optional)
30V 2A
SOD-123FL
On
Semiconductor
MBR230LSFT1G
1
Specifications subject to change
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