W567JXXX Datasheet, PDF (12/13 Pages) List of Unclassifed Manufacturers – 6-CHANNEL SPEECH+MELODY PROCESSOR

W567JXXX
d. PCB layout guide
1. The IC substrate should be connected to VSS in PCB layout, but VSSSPK can’t connect with IC
substrate directly. Both VSS and VSSSPK tie together in battery negative power.
2. Each VDD, VDDOSC, VDD_BP1, VDD1 and VDDSPK pad must connect to positive power to
support stable voltage for individual function work successfully. (Don’t let them be floating.)
8. REVISION HISTORY
VERSION
DATE
REASONS FOR CHANGE
A0.0
Jan 2007
Preliminary release.
A1.0
A2.0
A3.0
May 2007
Nov 2007
Sep. 2008
 Add SIM function
 Remove 32K Crystal current on DC characteristics
 Modify application circuit
 Remove multi-midi function
 Modify application circuit and naming
 Modify Logo
 Change logo
A4.0
Jun. 2009
 Modify application circuit
A5.0
May. 2010
 Add 2 battery application circuit
A6.0
Dec, 2010
 Update output current for BP1/2 @4.5V/3.0V and update BP0 @4.5V
 Add application circuit for Ring OSCin pin to add 120pF to VDD
 Modify the description for application circuit
 Support MD4 format for F/W library
A7.0
A8.0
A9.0
A10.0
July. 2011
Aug. 2011
Feb. 2012
Mar. 2012
 Add new chip W567J151/171
 Remove W567J160/170.
 Add new chip W567J151/171 pad description
 Add new chip W567J151/171 application circuit
 Add SIM application circuit
 Add W567CP80 OTP chip
 Add items vs pad table
 Modify application circuits
 BP00~BP03 share pins as OTP writer in W567CP80.
 Correct TEST pin as internal pull high
 Update operating current DC spec.
PAGE
6
8~15
8~15
3
2,
5
9~18
18
2
7
4
4
9
- 12 -