W567CXXX Datasheet, PDF (12/13 Pages) List of Unclassifed Manufacturers – 16-CHANNEL SPEECH+MELODY PROCESSOR

W567CXXX
(d) PCB layout guide
1. The IC substrate should be connected to VSS in PCB layout, but VSSSPK can’t connect with
IC substrate directly. Both VSS and VSSSPK tie together in battery negative power.
2. Each VDD, VDDOSC, VDD_BP1, VDD1 and VDDSPK pad must connect to positive power to
support stable voltage for individual function work successfully. (Don’t let them be floating.)
8. REVISION HISTORY
VERSION
A0.0
A1.0
A2.0
A3.0
DATE
Dec 2006
May 2007
Nov 2007
Sep. 2008
REASONS FOR CHANGE
Preliminary release.
 Add IO description for different body
 Modify application circuit
 Modify application circuit (naming)
 Modify Logo
 Change logo
A4.0
Jun. 2009
 Modify application circuit
A5.0
Jun. 2010
 Add application circuit for 2 battery
A6.0
Dec. 2010
 Update output current for BP1/2 @4.5V/3.0V and update BP0 @4.5V
 Add application circuit for Ring OSCin pin to 120pF to VDD for option
 Modify the description for application circuit
 Support MD4 format for F/W library
A7.0
A8.0
A9.0
A10.0
A11.0
July 2011
Aug. 2011
Jan. 2012
Mar. 2012
Jun. 2012
 Add new chip W567C151/171 application circuit
 Remove W567C150/170
 Add new chip W567C151/171 pad description
 Add new chip W567C151/171 application circuit
 Add SIM application circuits
 Add W567CP80 OTP chip
 Add items vs pad table
 Modify application circuits
 BP00~BP03 share pins as OTP writer in W567CP80.
 Update operating current DC spec.
 Revised VDD_SIM to VDD_BP1
PAGE
7
9~15
9~15
3
2, 5
9~18
2
5
9~20
20
2
7
4
9
5, 7
11~13
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