RN-42-DS Datasheet, PDF (10/12 Pages) List of Unclassifed Manufacturers – RN-42/RN-42-N Class 2 Bluetooth Module

RN-42-DS
 
Antenna Design
The pattern from the RF_OUT terminal pad should be designed with 50 ohms impedance and traced with straight lines
(see Figure 7). The RF_OUT signal line should not run under or near the RN-21 module. The GND plane should be on the
side of the PCB to which the module is mounted. GND should be reinforced with through-hole connections and other
means to stabilize the electric potential.
Figure 7. Antenna Design
GND
RF_OUT
GND
 
Solder Reflow Profile
The lead-free solder reflow temperature and times are:
• Temperature—230° C, 30 - 40 seconds, peak 250° C maximum
• Preheat temperature—165° ± 15° C, 90 to 120 seconds
• Time—Single pass, one time
 
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