TIC-1000A Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – High Performance, Value Compound for High-End Computer Processors

TIC 1000A
July 2011
PRODUCT DESCRIPTION
High Performance, Value Compound for
High-End Computer Processors
FEATURES AND BENEFITS
• High thermal performance: 0.32°C/W
(@ 50 psi)
• Good screenability
• Room temperature storage
• No post “cure” required
• Exceptional value
TIC^TM 1000A is a high performance,
thermally conductive compound intended
for use as a thermal interface material
between a highend computer processor
and a heat sink. Other high watt density
applications will also benefit from the
extremely low thermal impedance of
TIC^TM 1000A.
The TIC^TM 1000A compound wets-out the
thermal interface surfaces and flows to
produce the lowest thermal impedance.
The compound requires pressure of the
assembly to cause flow. The TIC^TM 1000A
compound will resist dripping.
For microprocessor applications, traditional
screw fastening or spring clamping
methods will provide adequate force to
optimize the thermal performance of
TIC^TM 1000A.
An optimized application would utilize the
minimum volume of TIC^TM 1000A material
necessary to ensure complete wet-out of
both mechanical interfaces.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF TIC 1000A
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gray
Gray
Visual
Density (g/cc)
2.1
2.1
ASTM D792
Continuous Use Temp (°F) / (°C)
302
150
—
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1)
N/A
N/A
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) (2) 0.32 0.32 0.32 0.31 0.28
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare material thermal performance.
Assembly – No Post Screen Cure
TIC^TM 1000A has good screenability. No solvent is used to reduce the viscosity,
so no post “cure” conditioning is required.
Application Cleanliness
1. P re-clean heat sink and component interface with isopropyl alcohol prior to
assembly or repair. Ensure heat sink is dry before applying TIC^TM 1000A.
Application Methods
1. D ispense and/or screenprint TIC^TM 1000A compound onto the processor or
heat sink surface like thermal grease (see a Bergquist Representative for
application information).
2. Assemble the processor and heat sink with spring clips or constant-
pressure fasteners.
TYPICAL APPLICATIONS INCLUDE
• High performance CPUs and GPUs
PDS_TIC_1000A_0711