SHT20P Datasheet, PDF (1/10 Pages) List of Unclassifed Manufacturers – DFN type package – reflow solderable

Datasheet SHT20P
Humidity and Temperature Sensor IC
 Fully calibrated
 Analog output, PWM interface
 Low power consumption
 Excellent long term stability
 DFN type package – reflow solderable
Product Summary
The SHT20P humidity and temperature sensor of
Sensirion has become an industry standard in terms of
form factor and intelligence: Embedded in a reflow
solderable Dual Flat No leads (DFN) package of 3 x 3mm
foot print and 1.1mm height it provides calibrated,
linearized sensor signals in analog Pulse Width
Modulated (PWM) format.
The SHT2x sensors contain a capacitive type humidity
sensor, a band gap temperature sensor and specialized
analog and digital integrated circuit – all on a single
CMOSens^® chip. This yields in an unmatched sensor
performance in terms of accuracy and stability as well as
minimal power consumption.
The PWM signal runs on a base frequency of 120Hz, the
data signal is provided on SDA line. Pulling SCL high or
low allows for switching between humidity and
temperature, respectively. The sensor measures twice per
second. The PWM signal may be converted to an analog
ratiometric interface by adding a low pass filter.
Every sensor is individually calibrated and tested. Lot
identification is printed on the sensor.
With this set of features and the proven reliability and
long-term stability, the SHT2x sensors offer an
outstanding performance-to-price ratio. For testing SHT2x
two evaluation kits EK-H4 and EK-H5 are available.
Dimensions
3.0
0.3 typ
1.4 max
2.2
0.4 0.3
2.4
1.1
Bottom
View
NC VDD SCL
1.0 1.0
NC ^{VSS SDA}
Figure 1: Drawing of SHT20P sensor package, dimensions
are given in mm (1mm = 0.039inch), tolerances are ±0.1mm.
The die pad (center pad) is internally connected to VSS. The NC
pads must be left floating. Numbering of E/O pads starts at lower
right corner (indicated by notch in die pad) and goes clockwise
(compare Table 2).
Sensor Chip
SHT20P features a generation 4C CMOSens® chip.
Besides the capacitive relative humidity sensor and the
band gap temperature sensor, the chip contains an
amplifier, A/D converter, OTP memory and a digital
processing unit.
Material Contents
While the sensor itself is made of Silicon the sensors’
housing consists of a plated Cu lead-frame and green
epoxy-based mold compound. The device is free of Pb, Cd
and Hg – hence it is fully RoHS and WEEE compliant.
Additional Information
Additional information such as Application Notes is
available from the web page www.sensirion.com/SHT20 .
For more information please contact Sensirion via
[e-mail].
www.sensirion.com
Version 4 – May 2014
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