Q-PAD-II Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Designed to replace thermal grease

Q-Pad^® II
January 2015
PRODUCT DESCRIPTION
Foil-Format Grease Replacement
for Maximum Heat Transfer
FEATURES AND BENEFITS
• Thermal impedance: 0.22°C-in²/W
(@50 psi)
• Maximum heat transfer
• Aluminum foil coated both sides
• Designed to replace thermal grease
Q-Pad^® II is a composite of aluminum foil
coated on both sides with thermally/
electrically conductive Sil-Pad^® rubber.
The material is designed for those
applications in which maximum heat
transfer is needed and electrical isolation
is not required. Q-Pad^® II is the ideal
thermal interface material to replace
messy thermal grease compounds.
Q-Pad^® II eliminates problems
associated with grease such as
contamination of reflow solder or cleaning
operations. Unlike grease, Q-Pad^® II can
be used prior to theseoperations. Q-Pad^®
II also eliminates dust collection which
can cause possible surface shorting or
heat buildup..
Note: To build a part number, visit our
website at www.bergquistcompany.com.
PROPERTY
TYPICAL PROPERTIES OF Q-PAD II
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
93
93
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Non-Insulating
Non-Insulating
ASTM D149
Dielectric Constant (1000 Hz)
NA
Volume Resistivity (Ohm-meter)
10²
NA
ASTM D150
10²
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
2.5
2.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 2.44 1.73 1.23 1.05 0.92
Thermal Impedance (°C-in²/W) (1) 0.52
0.30
0.22
0.15
0.12
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
PDS_QP_II_January 2015