Q-PAD-3 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Conforms to surface textures

Q-Pad^® 3
December 2008
PRODUCT DESCRIPTION
Glass-Reinforced Grease
Replacement Thermal Interface
FEATURES AND BENEFITS
• Thermal impedance: 0.35°C-in²/W
(@50 psi)
• E liminates processing constraints
typically associated with grease
• Conforms to surface textures
• Easy handling
• M ay be installed prior to soldering and
cleaning without worry
Q-Pad^® 3 eliminates problems associated
with thermal grease such as contamination
of electronic assemblies and reflow solder
baths. Q-Pad^® 3 may be installed prior to
soldering and cleaning without worry. When
clamped between two surfaces, the
elastomer conforms to surface textures
thereby creating an air-free interface
between heat-generating components
and heat sinks.
Fiberglass reinforcement enables Q-Pad^® 3
to withstand processing stresses without
losing physical integrity. It also provides
ease of handling during application.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
PROPERTY
TYPICAL PROPERTIES OF Q-PAD 3
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Hardness (Shore A)
86
86
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Non-Insulating
Non-Insulating
ASTM D149
Dielectric Constant (1000 Hz)
NA
Volume Resistivity (Ohm-meter)
10²
NA
ASTM D150
10²
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 2.26 1.99 1.76 1.53 1.30
Thermal Impedance (°C-in²/W) (1) 0.65
0.48
0.35
0.24
0.16
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
PDS_QPad_3_December 2008