POLYPADK-4 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Excellent dielectric and physical strength

Poly-Pad^® K-4
November 2013
PRODUCT DESCRIPTION
Polyester-Based,Thermally
Conductive Insulation Material
FEATURES AND BENEFITS
• Thermal impedance: 0.95°C-in²/W
(@50 psi)
• Polyester based
• F or applications requiring non-silicone
conformal coatings
• D esigned for silicone-sensitive
applications
• Excellent dielectric and physical strength
Poly-Pad^® K-4 is a composite of film
coated with a polyester resin.The material
is an economical insulator and the film
carrier provides excellent dielectric and
physical strength.
Polyester-based, thermally conductive
insulators from Bergquist provide a
complete family of materials for
silicone-sensitive applications.
Poly-Pads are ideally suited for
applications requiring conformal
coatings or applications where silicone
contamination is a concern (telecomm
and certain aerospace applications).
Poly-Pads are constructed with
ceramic-filled polyester resins coating
either side of a fiberglass carrier or a
film carrier. The Poly-Pad^® family offers
a complete range of performance
characteristics to match individual
applications.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF POLY-PAD K-4
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Tan
Tan
Visual
Reinforcement Carrier
Polyimide
Polyimide
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
Tensile Strength (psi) / (MPa)
5000
34
ASTM D412
Continuous Use Temp (°F) / (°C)
-4 to 302
-20 to 150
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
6000
5.0
10¹²
6000
5.0
10¹²
ASTM D149
ASTM D150
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 5.64 5.04 4.34 3.69 3.12
Thermal Impedance (°C-in²/W) (1) 1.55
1.21
0.95
0.70
0.46
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Power supplies
• Motor controls
• Power semiconductors
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
PDS_PP_K4_November 2013