PDV-C173SM Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – Photodiode in Plastic Surface Mount Package

PDV-C173SM
Photodiode in Plastic Surface Mount Package
PA_PC_AK_CA_KG_AGE_ED_DI_IM_ME_ENN_SS_IOIO_NN_SS_INI_CN_HC_[H_mm[m_] m]
.158 [4.00]
.079 [2.00]
CATHODE
.043 [1.10]
.019 [0.48]
CATHODE MARK
2X .020 [0.51]
.085 [2.15]
.197 [5.00]
130°
VIEWING
ANGLE
.173 [4.40]
.158 [4.00]
ANODE
.012 [0.30]
CHIP DIMENSIONS INCH [mm]
CHIP DIMENSIONS INCH [mm]
.118 [3.00] SQUARE
.109 [2.77] SQUARE
ACTIVE AREA
2X .047 [1.19]
.142 [3.61]
2X .158 [4.00]
SURFACE M_SO_UGU_GEN_ST_TEDP_PA_ADC_LAK_YOA_UG_T E
FOR REFLOW SOLDERING
SURFACE MOUNT PACKAGE
FEATURES
• Surface mount
• Photoconductive
• Low cost
• High speed
DESCRIPTION
The PDV-C173SM is a blue enhanced PIN silicon
photodiode ideal for high speed photoconductive or
photovoltaic applications packaged in a red plastic
surface mount package.
APPLICATIONS
• Photointerrupters
• Oximeter sensors
• Barcode
• Glucometers
ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL PARAMETER
V_BR
T_STG
T_O
T_S
Reverse Voltage
Storage Temperature
Operating Temperature
Soldering Temperature*
* 1/16 inch from case for 3 seconds max.
MIN MAX UNITS
60
V
-55 +100 °C
-40 +80
°C
+260 ^°C
SPECTRAL RESPONSE
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
250 350 450 550 650 750 850 950 1050 1150
Wavelength (nM)
ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL
I_SC
I_D
R_SH
C_J
lrange
V_BR
NEP
t_r
CHARACTERISTIC
Short Circuit Current
Dark Current
Shunt Resistance
Junction Capacitance
Spectral Application Range
Breakdown Voltage
Noise Equivalent Power
Response Time
TEST CONDITIONS
H = 100 fc, 2850 K
V_R = 10 V
V_R = 10 mV
V_R = 10 V, f = 1 MHz
Spot Scan
I = 10 μA
V_R = 10V @ l=Peak
RL = 1KΩ,V_R = 10 V
MIN
600
60
TYP
90
4
400
15
4x10^-14
20
MAX
30
1050
UNITS
μA
nA
MW
pF
nm
V
W/ √ _Hz
nS
**Response time of 10% to 90% is specified at 660nm wavelength light.
Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are
subject to change without notice.
www.lasercomponents.com
Issue: 08/06 / V1 / HW / api/si-pin/plastic-encap-sm/ pdv-c173sm.pdf
Germany and other countries: LASER COMPONENTS GmbH, Phone: [phone], Fax: [phone], [e-mail]
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: [phone], Fax: [phone], [e-mail]