PDS_BP-800 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape

Bond-Ply^® 800
July 2014
PRODUCT DESCRIPTION
Thermally Conductive, Fiberglass Reinforced
Pressure Sensitive Adhesive Tape
FEATURES AND BENEFITS
• Thermal impedance: 0.60°C-in²/W
(@50 psi)
• H igh bond strength to most epoxies
and metals
• D ouble-sided, pressure sensitive
adhesive tape
• H igh performance, thermally conductive
acrylic adhesive
• M ore cost-effective than heat-cure
adhesive, screw mounting or
clip mounting
Bond-Ply^® 800 is a thermally conductive,
electrically isolating double-sided tape.
Bond-Ply^® 800 is utilized in lighting
applications that require thermal transfer
and electric isolation. High bond strengths
obtained at ambient temperature lead to
significant processing cost savings in
labor, materials and throughput due to the
elimination of mechanical fasteners and
high temperature curing.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF BOND-PLY 800
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005, 0.008
0.127, 0.203
ASTM D374
Elongation (%, 45° to Warp & Fill)
70
70
ASTM D412
Tensile Strength (psi) / (MPa)
1500
10
ASTM D412
CTE (um/m-°C), -40°C to +125°C
600
600
ASTM D3386
Continuous Use Temp (°F) / (°C)
-40 to 257
-40 to 125
—
ADHESION
Lap Shear @ RT (psi) / (MPa) (1)
150
1.0
ASTM D1002
ELECTRICAL
VALUE
TEST METHOD
Dielectric Breakdown Voltage (Vac), 0.005
4000
ASTM D149
Dielectric Breakdown Voltage (Vac), 0.008
6000
ASTM D149
Dielectric Constant (1000 Hz)
4.0
ASTM D150
Volume Resistivity (Ohm-meter)
Flame Rating
10¹¹
ASTM D257
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.8
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds) 10
25
50
100
200
TO-220 Thermal Performance (°C/W), 0.005 5.0
5.0
4.8
4.3
4.2
TO-220 Thermal Performance (°C/W), 0.008 6.2
6.0
5.6
5.3
5.2
Thermal Impedance (°C-in²/W), 0.005 (2) 0.63
0.62
0.60
0.58
0.57
Thermal Impedance (°C-in²/W), 0.008 (2) 0.78
0.74
0.72
0.71
0.71
1) Tested per ASTM D1002 with aluminum lap shear samples, 75 psi applied for 5 seconds then pressure removed. 0.5 square inch
Bond-Ply 800 sample.
2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Mount LED assembly to troffer housing
• Mount LED assembly to heat sink
• Mount heat spreader onto power converter PCB or onto motor control PCB
• Mount heat sink to BGA graphic processor or drive processor
CONFIGURATIONS AVAILABLE
• Sheet form, roll form and die-cut parts
PDS_BP_800_July 2014