PDS_BP-660P Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, Film Reinforced,Pressure Sensitive Adhesive Tape

Bond-Ply^® 660P
July 2014
PRODUCT DESCRIPTION
Thermally Conductive, Film Reinforced,
Pressure Sensitive Adhesive Tape
FEATURES AND BENEFITS
• Thermal impedance: 0.87°C-in²/W
(@50 psi)
• Highly puncture resistant Polyimide
reinforcement carrier
• Double-sided pressure sensitive
adhesive tape
• Provides a mechanical bond,
eliminating the need for mechanical
fasteners or screws
Bond-Ply^® 660P is a thermally conductive,
electrically insulating, double sided
pressure sensitive adhesive tape. The
tape consists of a high performance,
thermally conductive acrylic adhesive
coated on both sides of a Polyimide
film. Use Bond-Ply^® 660P in applications to
replace mechanical fasteners or screws.
Shelf Life: The double-sided, pressure
sensitive adhesive used in Bond-Ply^®
products requires the use of dual liners to
protect the surfaces from contaminants.
The recommended shelf life for Bergquist
Bond-Ply^® 660P is 6-months at a
maximum continuous storage temperature
of 35°C or 3-months at a maximum
continuous storage temperature of 45°C,
for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply^®
material, without consideration of liner
adhesion (which is often not critical for
manual assembly processing), is
recommended at 12 months from date of
manufacture at a maximum continuous
storage temperature of 60°C.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF BOND-PLY 660P
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Light Brown
Light Brown
Visual
Reinforcement Carrier
Polyimide Film
Polyimide Film
—
Thickness (inch) / (mm)
0.008
0.203
ASTM D374
Glass Transition (°F) / (°C)
Continuous Use Temp (°F) / (°C)
-22
-40 to 257
-30
-40 to 125
ASTM E1356
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
ELECTRICAL
VALUE
TEST METHOD
Dielectric Breakdown Voltage (Vac)
6000
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Post-Cured Thermal Conductivity (W/m-K)
0.4
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 5.48
5.47
5.15
5.05
5.00
Thermal Impedance (°C-in²/W) (1) 0.83
0.82
0.81
0.80
0.79
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Heat sink onto BGA graphic processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
CONFIGURATIONS AVAILABLE
• Roll form and die-cut parts
The material as delivered will include a continuous base liner with
differential release properties to allow for simplicity in roll packaging
and application assembly.
PDS_BP_660P_July 2014