PDS_BP-400 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, Unreinforced,Pressure Sensitive Adhesive Tape

Bond-Ply^® 400
July 2014
PRODUCT DESCRIPTION
Thermally Conductive, Unreinforced,
Pressure Sensitive Adhesive Tape
FEATURES AND BENEFITS
• Thermal impedance: 0.87°C-in²/W
(@50 psi)
• Easy application
• E liminates need for external hardware
(screws, clips, etc.)
• Available with easy release tabs
Bond-Ply^® 400 is an un-reinforced,
thermally conductive, pressure sensitive
adhesive tape. The tape is supplied with
protective topside tabs and a carrier liner.
Bond-Ply^® 400 is designed to attain high
bond strength to a variety of “low energy”
surfaces, including many plastics, while
maintaining high bond strength with long
term exposure to heat and high humidity.
Shelf Life: The double-sided, pressure
sensitive adhesive used in Bond-Ply^®
products requires the use of dual liners to
protect the surfaces from contaminants.
The recommended shelf life for Bergquist
Bond-Ply^® 400 is 6-months at a maximum
continuous storage temperature of 35°C
or 3-months at a maximum continuous
storage temperature of 45°C, for
maintenance of controlled adhesion to the
liner. The shelf life of the Bond-Ply^®
material, without consideration of liner
adhesion (which is often not critical for
manual assembly processing), is
recommended at 12 months from date of
manufacture at a maximum continuous
storage temperature of 60°C.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF BOND-PLY 400
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
White
White
Visual
Thickness (inch) / (mm)
0.003 to 0.010
0.076 to 0.254
ASTM D374
Glass Transition (°F) / (°C)
-22
-30
ASTM E1356
Continuous Use Temp (°F) / (°C)
-22 to 248
-30 to 120
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
ELECTRICAL
VALUE
TEST METHOD
Dielectric Breakdown Voltage (Vac)
3000
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.4
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.005" 5.4
5.4
5.4
5.4
5.4
Thermal Impedance (°C-in²/W) (1)
0.87
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Heat sink onto BGA graphic processor
• Heat sink to computer processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
CONFIGURATIONS AVAILABLE
• Die-cut parts (supplied on rolls with easy release, protective tabs)
PDS_BP_400_July 2014