PC93-20-5-2 Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – Non-Silicone Thermal Conductive Pad

PC93
Non-Silicone Thermal Conductive Pad
Features
Low contact thermal impedance
Good thermal conductivity
Silicone free
Long term stability
Applications
Electronic components: IC / CPU / MOS
LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
Wireless Hub etc....
DDR II Module / DVD Applications / Hand-Set applications etc...
Thermal Resistance V.S Pressure V.S Deflection
Properties
Thermal Conductivity: 2 W/mK
(W/mK - Z Axis)
REACH Compliant
RoHS Compliant
Hardness: 60 (Shore 00)
(Shore 00)
In the thermal resistance vs pressure vs deflection charts PC93 provides low thermal impedance.
As the pressure increases the thermal impedance decreases. PC93 provides good compliance and softness.
Property
Colour
Thickness
(Available thickness range)
Thermal Conductivity
Flammability Rating
Dielectric Breakdown Voltage
Weight Loss
Specific Gravity
Working Temperature
Volume Resistance
Elongation
Tensile Strength
Standard Shape
Hardness
PC93
Grey
0.25 - 5.0
0.0098 - 0.1969
2
V-0
10
‹1
1.5
-30 to 150
›10¹²
350
1
-
60
Unit
-
mm
inch
W/mK
-
kV/mm
%
g/cm³
˚C
Ohm-cm
%
Kgf/mm²
Sheets 320-320mm
Shore 00
Tolerance
-
-
-
-
-
-
-
±0.2
-
-
±13
±2
-
±5
Test Method
Visual
ASTM D374
ASTM D374
ASTM D5470
UL 94
ASTM D149
ASTM E595
ASTM D792
-
ASTM D257
ASTM D412
ASTM D412
-
ASTM D2240
Available with an adhesive backing
1. Part Number
2. Size X-Y-Z
3. Adhesive backing – 0-None, 1A-one side, 2A-two sides
4. Quantity
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