PA03_17 Datasheet, PDF (1/5 Pages) List of Unclassifed Manufacturers – Power Operational Amplifiers

PA03, PA03A
PA03PA•0P3 A• P0A30A3A
Power Operational Amplifiers
FEATURES
• MO-127 COPPER POWER DIP™ PACKAGE
• HIGH INTERNAL POWER DISSIPATION
  — 500 watts
• HIGH VOLTAGE OPERATION — ±75V
• VERY HIGH CURRENT — ±30 amps
• INTERNAL SOA PROTECTION
• OUTPUT SWINGS CLOSE TO SUPPLY RAILS
• EXTERNAL SHUTDOWN CONTROL
APPLICATIONS
• LINEAR AND ROTARY MOTOR DRIVES
• YOKE/MAGNETIC FIELD DEFLECTION
• PROGRAMMABLE POWER SUPPLIES to ±68V
• TRANSDUCER/AUDIO TO 1000W
DESCRIPTION
The super power PA03 advances the state of the art in
both brute force power and self protection against abnormal
operating conditions. Its features start with a copper dip pack-
age developed by Apex Microtechnology to extend power
capabilities well beyond those attainable with the familiar
TO-3 package. The increased pin count of the new package
provides additional control features, while the superior thermal
conductivity of copper allows substantially higher power ratings.
The PA03 incorporates innovative current limiting circuits
limiting internal power dissipation to a curve approximating
the safe operating area of the power transistors. The internal
current limit of 35A is supplemented with thermal sensing
which reduces the current limit as the substrate temperature
rises. Furthermore, a subcircuit monitors actual junction
temperatures and with a response time of less than ten mil-
liseconds reduces the current limit further to keep the junction
temperature at 175°C.
The PA03 also features a laser trimmed high performance
FET input stage providing superior DC accuracies both initially
and over the full temperature range.
EQUIVALENT ₈ +V
SCHEMATIC
BAL
11
BAL
12
D1
Q2
Q3
Q5
4
Q14
+SHUT
Q17
Q18 ^DOWN
–
1
Q20 Q20
A
B
Q22
3
–SHUT
+
DOWN
2
Q31
D4
5 ^–V
TYPICAL APPLICATION
+V_S
12-PIN DIP
PACKAGE STYLE CU
POSITION
FEEDBACK
+5V
R_BAL
+
+S
OBJECT
TOOL
SHUT DOWN
0/10V
DAC
R1
DESIRED
POSITION
–S PA03
–
–V_S
C₁
R2
The PA03 output power stages contain fast reverse recovery
diodes for sustained high energy flyback protection.
This hybrid integrated circuit utilizes thick film resistors,
ceramic capacitors and silicon semiconductors to maximize
reliability, minimize size and give top performance. Ultra-
sonically bonded aluminum wires provide reliable intercon-
nections at all operating temperatures. The MO-127 Copper,
12-pin Power Dip™ package (see Package Outlines), is
hermetically sealed and isolated from the internal circuits.
Insulating washers are not recommended.
IMPORTANT: Observe mounting precautions.
Q1
Q4
Q12
9
COMP
10
Q6 _Q7
Q19
Q29 ^Q30
Q34
Q9
D2
Q16
Q24
+
7
OUT
6
–
D3
Q32
Q26
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(All Rights Reserved)
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