MHI0402C5N6ST-PB Datasheet, PDF (1/3 Pages) List of Unclassifed Manufacturers – Tin Whisker Mitigation Process

Tin Whisker Mitigation Process
aerospace
military
aviation
medical
AEM’s Sn/Pb Conversion Process
n Includes both Sn/Pb plating and subsequent fusion
processing to ensure that resultant component termi-
nation finishes are a homogenous mixture of Sn/Pb.
n Ensures that all areas of each component termination
are converted to Sn/Pb (including termination locations
in egress and wrap-around areas).
n Includes monitoring of component quality going into
and out of the Sn/Pb conversion process (QA1/QA2/
DPA – to verify solderability, leach resistance, and
terminal adhesion strength).
n Ensures that converted component terminations con-
tain a minimum of 5% Pb as verified by SEM/EDS and
XRF inspection methods.
n May be followed by 100% electrical or customer speci-
fied up-screening activities. 100% visual inspection at
7X-10X magnification levels is performed by AEM on all
Sn/Pb conversion lots.
n Included within the scopes of AEM’s AS9100 and IS0
9001:2008 QMS Certifications.
As a leading producer of high-reliability passive
components for use in military, aerospace
and medical electronic devices, AEM, Inc. has
devised an aerospace-qualified tin/lead (Sn/Pb)
conversion process designed to virtually eliminate
the formation of tin whiskers on surface-mount
component terminations (including types with
external terminals). The AEM proprietary plating
process delivers superior quality while eliminating
the potential damage to sensitive electronic devices
caused by conventional hot-solder dipping. AEM’s
Sn/Pb conversion process is ideal for chip scale
passive components including capacitors, inductors,
resistors, ferrite chip beads, fuses, resistor arrays,
capacitor arrays, bead arrays and many molded body
passive and active surface mount component types.
AEM, INC.
6610 Cobra Way, San Diego, CA 92121, USA
858.481.0210
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