MCFT000148 Datasheet, PDF (1/10 Pages) List of Unclassifed Manufacturers – Wire Wound Chip Inductor

Wire Wound Chip Inductor
Construction
1 Ceramic Core 3 Electrode (Ag/Pd+Ni+Sn)
2 Magnet Wire 4
UV Glue
Dimensions
Features
•  Ceramic base provide high SRF
•  Ultra-compact inductors provide high Q factors
•  Low profile, high current options
•  Miniature SMD chip inductor for fully automated assembly
•  Outstanding endurance from Pull-up force, mechanical
shock and pressure
•  Tighter tolerance down to ±2%
•  Smaller size of 0402 (1005)
Applications
RF Products:
•  Cellular Phone (CDMA/GSM/PHS)
•  Cordless Phone (DECT/CT1CT2)
•  Remote Control, Security System
•  Wireless PDA
•  Smart Phone
•  WLL, Wireless LAN / Mouse / Keyboard / Earphone
•  VCO, RF Module & Other Wireless Products
•  Base Station, Repeater
•  GPS Receiver
Broad Band Applications:
•  CATV Filter, Tuner
•  Cable Modem/ XDSL Tuner
•  Set Top Box
IT Applications:
•  USB 2.0
•  IEEE 1394
Standard
Type
Size
(Inch)
MCFT02
MCFT03
MCFT05
MCFT06
0402
0603
0805
1206
A
B
max. max.
1.27 0.76
1.8 1.12
2.29 1.73
3.45 1.9
C
max.
0.61
1.02
1.52
1.4
D
Ref.
E
F
0.15 0.51 0.23
0.38 0.76 0.33
0.51 1.27 0.44
0.5 1.6 0.5
G
0.56
0.86
1.02
2.2
Unit: mm
Weight
H
I
J
(g)
(1,000pcs)
0.66 0.5 0.46
0.8
1.02 0.64 0.64
3.46
1.78 1.02 0.76
12.13
1.93 1.02 1.78
40
www.element14.com
www.farnell.com
www.newark.com
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18/07/12 V1.0