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LR2512-R10FW Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Low Value Flat Chip Resistor
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LRC/LRF SLeRrCie/sLRF Series
·LRSCta/LnRdFasrSdeS2rtia5en1sd2a, r2d012501a2n, d2011200a6nsdiz1e2s06 sizes
·s RSetasnisdtasnrdcRe2ev5sia1sl2tua,en2sc0ed1vo0awalunedtso1d20o0.w060ns3tizooeh0sm.00s3 ohms
·s LReeascishtarsenscLiesetavacanhlturseosilsddtoearwn-tpnlsaottoledde0r.c-0po0lpa3ptoeedhrmcospper
·s wLeraacph-arreoswuisnrtadapnt-taerrsomoulidnnedartt-ipeorlnamtiendatcioonpper
AwErCa-pQ-a2sr0o0LuoQnwduaitnleidfruimecdtinanactieo-nless than 0.2nH
s Low insduAcEtaCn-Qce20-0leQsusatlhifaiend0.2nH
s AEC-Q200 Qualified
Welwyn Components
Welwyn Components
Electrical Data
Electrical Data
Power rating at 70°C
watts
LR1206
0.5
LR2010
1.0
LR2512
1.5/2.0*
Resistance range
ohmsLR12006R010 to 1R
LR2001R0003 to 1R
LR205R10203 to 1R
Power rating Daite7le0c°trCic withstanding voltage
watts volts 0.5 200
1.0 200
1.5/2.0*200
Resistance ranTgCeR
ohms ppm/°0CR010 to 1R ±100 (Con0taRc0t0f3actory1Rfor value belo0wR000.035t0o o1hRms)
Dielectric withRsetsaisntdanincge vtoolletraagnece
volts
%
TCR
Temperature rise at rated power
ppm/°C
°C
Resistance tolPeardanacned trace area for max power rating @ 70°C
%
mm2
Temperature*2risWe attrsatwedithpotwotearl solder pad and trace size of 300°mC m2
200
≤R0025050%, >R005 1, 2, 5% 200
±100 (C4o0ntact factory for valu8e0below 0.050 ohms)90
30≤R005 5%, >R005 13,02, 5%
100
40
80
90
Pad and trace area for max power rating @ 70°C
mm2
30
Physical Data *2 Watts with total solder pad and trace size of 300 mm2
30
100
Dimensions (mm)
PhysicaSizle Data
L
W
LR1206
Dimensions L(mR2m01)0
Size
LR2512
LR1206
3.20±0.305
1.63±0.203
5.23±0.38
L
6.50±0.38
3.20±0.305
2.64±0.25
W 3.25±0.25
1.63±0.203
LR2010
LR2512
5.23±0.38
6.50±0.38
2.64±0.25
3.25±0W.25
H (max)
D
0.8
0.48±0.25
0.8
0.48±0.25
H (max) 0.8
D 0.48±0.25
LR 01.2806 / 2010 / 25102.48±0.25
0.8
0.48±0.25
L0.8
0.48±0.25
H
LR 1206 / 2010 / 2512
W
L
D
H
Protective Overcoat
Resistive Element
D
Copper Termination
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
D1
0.48±0.25
0.48±0.25
D10.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
A subsidiary of
TT electronics plc
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Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
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