LPG10 Datasheet, PDF (1/5 Pages) List of Unclassifed Manufacturers – Calibrated and temperature compensated digital output

Preliminary Product Specifications
LPG10 Liquid Flow Sensor (Preliminary Datasheet)
Digital Planar Package Sensor
 Ultra small size
 Excellent repeatability
 Bio-compatible & inert materials
 Calibrated and temperature compensated digital output (I²C)
Product Summary
Unique CMOSens® planar packaging technology
allows low fabrication costs by enabling non-invasive
measurement of liquid flow inside a cost-effective
planar substrate (US Patent 7905140). The flow
channel passes through this planar substrate and will
be connected to fluidic channels in a manifold. The
fluid will only be in contact with the glass channel.
The digital microsensor chip provides the full signal
processing functionality for a fully calibrated,
temperature compensated digital output
Integrating the LPG10 sensor models
Due to the dramatically reduced size and downmount fluidic connections, the LPG10 sensor family allows an
outstanding mechanical, fluidic and electronic integration. An evaluation kit with sample-manifold is available for
initial testing.
1 Sensor Performance (subject to change)
Table 1: Performance of LPG10 models (all data for medium H2O, 20°C, 1 barabs unless otherwise noted)
Parameter
LPG10-0150 LPG10-0500 LPG10-1000
Unit
Full Scale Flow Rate
10
100
1000
l/min
Sensor Output Limit^a
15
150
1500
l/min
Accuracy below full scale
(whichever error is larger)
5
5
5
% of measured value
tbd
0.2
0.25
% of full scale
Repeatability error from zero to full scale
1
(whichever error is larger)
tbd
1
1
% of measured value
0.04
0.05
% of full scale
Flow Detection Response Time 63
40
ms
Response Time On Power-Up
120
ms
Operating Temperature
+10 … +50
°C
Ambient Storage Temperature^b
-40 … +80
°C
Operating Pressure
tbd
10
3
bar (psi)
Proof Pressure^c
tbd
20
7
bar (psi)
a_{Flow rate at which the sensor output saturates, see Section 2 for performance specifications between full scale and saturation point}
b_{Non-condensing, flow path empty}
c_{Pressures listed are mechanical limits of glass substrate; Proof pressure of manifold assembly depends on customer manifold seal design}
www.sensirion.com
Version 4 (Subject to Change) – July 2015
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