LB-SA-2000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, One-Part,Liquid Silicone Adhesive

Liqui-Bond^® SA 2000 (One-Part)
March 2012
PRODUCT DESCRIPTION
Thermally Conductive, One-Part,
Liquid Silicone Adhesive
FEATURES AND BENEFITS
• High thermal conductivity: 2.0 W/m-K
• Eliminates need for mechanical fasteners
• One-part formulation for easy dispensing
• Mechanical and chemical stability
• Maintains structural bond in severe-
environment applications
• Heat cure
Liqui-Bond^® SA 2000 is a high performance,
thermally conductive silicone adhesive that
cures to a solid bonding elastomer.
Liqui-Bond^® SA 2000 is supplied as a
one-part liquid component, in either tube or
mid-sized container form.
Liqui-Bond^® SA 2000 features excellent
low and high-temperature mechanical and
chemical stability.The material’s mild
elastic properties assist in relieving CTE
stresses during thermal cycling.
Liqui-Bond^® SA 2000 cures at elevated
temperatures and requires refrigeration
storage at 10°C.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF LIQUI-BOND SA 2000
PROPERTY AS SUPPLIED
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Yellow
Yellow
Visual
Viscosity (cps) (1)
200,000
200,000
ASTM D2196
Density (g/cc)
2.4
2.4
ASTM D792
Shelf Life @ 10°C (months)
6
6
—
PROPERTY AS CURED - PHYSICAL
Hardness (Shore A)
80
80
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
Shear Strength (psi) / (MPa)
200
1.4
ASTM D1002
PROPERTY AS CURED - ELECTRICAL
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L.94
PROPERTY AS CURED - THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (hours) (2)
24
24
—
Cure @ 125°C (minutes) (3)
20
20
—
Cure @ 150°C (minutes) (3)
10
10
—
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25°C.
2) Based on 1/8" diameter bead.
3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• PCBA to housing
• Discrete component to heat spreader
CONFIGURATIONS AVAILABLE
• With or without glass beads
PDS_LB_SA 2000_March 2012