LB-SA-1800 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, One-Part,Liquid Silicone Adhesive

Liqui-Bond^® SA 1800 (One-Part)
March 2012
PRODUCT DESCRIPTION
Thermally Conductive, One-Part,
Liquid Silicone Adhesive
FEATURES AND BENEFITS
• High thermal conductivity: 1.8 W/m-K
• Eliminates need for mechanical fasteners
• Low viscosity for ease of screening
or stenciling
• Maintains structural bond in severe
environment applications
• Heat cure
Liqui-Bond^® SA 1800 is a high performance,
liquid silicone adhesive that cures to a solid
bonding elastomer.The adhesive is supplied
as a one-part liquid component, offered in a
tube or mid-size container.
Liqui-Bond^® SA 1800 features a
combination of high thermal conductivity
with a low viscosity which allows for ease
of screen or stencil application.This
material is also ideal for high volume
automated pattern dispensing.
Liqui-Bond^® SA 1800’s low viscosity
allows the material to achieve a very thin
bond line, producing excellent thermal
performance and a high shear strength.
Liqui-Bond^® SA 1800’s mild elastic
properties assist in relieving CTE stresses
during thermal cycling.The material cures at
elevated temperatures and requires refriger-
ation storage at 10°C. Liqui-Bond^® SA 1800
is available with optional glass beads to
provide a consistent stand-off and ensure
dielectric integrity.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF LIQUI-BOND SA 1800
PROPERTY AS SUPPLIED
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Viscosity (cps) (1)
125,000
125,000
ASTM D2196
Density (g/cc)
2.8
2.8
ASTM D792
Shelf Life @ 10°C (months)
6
6
—
PROPERTY AS CURED - PHYSICAL
Hardness (Shore A)
80
80
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
Shear Strength (psi) / (MPa)
200
1.4
ASTM D1002
PROPERTY AS CURED - ELECTRICAL
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L.94
PROPERTY AS CURED - THERMAL
Thermal Conductivity (W/m-K)
1.8
1.8
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (hours) (2)
10
10
—
Cure @ 125°C (minutes) (3)
20
20
—
Cure @ 150°C (minutes) (3)
10
10
—
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25°C.
2) Based on 1/8" diameter bead.
3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• PCB assembly to housing
• Discrete component to heat spreader
CONFIGURATIONS AVAILABLE
• With or without glass beads
PDS_LB_SA 1800_March 2012