KX023-1025 Datasheet, PDF (1/75 Pages) List of Unclassifed Manufacturers – Accelerometer Specifications

± 2g / 4g / 8g Tri-axis Digital
Accelerometer Specifications
PART NUMBER:
KX023-1025
Rev. 11.0
10-Sep-15
Product Description
The KX023 is a tri-axis ±2g, ±4g or ±8g silicon micromachined
accelerometer with integrated 256 byte buffer, orientation, tap/double
tap, and activity detecting algorithms. The sense element is fabricated
using Kionix’s proprietary plasma micromachining process technology.
Acceleration sensing is based on the principle of a differential
capacitance arising from acceleration-induced motion of the sense
element, which further utilizes common mode cancellation to decrease
errors from process variation, temperature, and environmental stress.
The sense element is hermetically sealed at the wafer level by bonding a
second silicon lid wafer to the device using a glass frit. A separate ASIC
device packaged with the sense element provides signal conditioning,
and intelligent user-programmable application algorithms. The
accelerometer is delivered in a 3 x 3 x 0.9 mm LGA plastic package
operating from a 1.8 – 3.6V DC supply. Voltage regulators are used to
maintain constant internal operating voltages over the range of input supply voltages. This results in
stable operating characteristics over the range of input supply voltages and virtually undetectable
ratiometric error. I²C or SPI digital protocol is used to communicate with the chip to configure and
check for updates to the orientation, Directional Tap^TM detection and activity monitoring algorithms.
Features
 3 x 3 x 0.9 mm LGA
 User-selectable g Range and Output Data Rate
 User-selectable low power mode or high resolution mode
 Digital High-Pass Filter Outputs
 Embedded FIFO/FILO buffer
 Low Power Consumption with FlexSet™ Performance Optimization
 Internal voltage regulator
 Enhanced integrated Directional Tap/Double-Tap^TM, and Device-orientation Algorithms
 User-configurable wake-up function
 Digital I²C up to 3.4 MHz
 Digital 3-wire and 4-wire SPI up to 10 MHz
 Lead-free Solderability
 Excellent Temperature Performance
 High Shock Survivability
 Factory Programmed Offset and Sensitivity
 Self-test Function
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