KVR16LR11D4-16KF Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – 16GB 2Rx4 2G x 72-Bit PC3L-12800

Memory Module Specifications
KVR16LR11D4/16KF
16GB 2Rx4 2G x 72-Bit PC3L-12800
CL11 Registered w/Parity 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 2G x 72-bit (16GB)
DDR3L-1600 CL11 SDRAM (Synchronous DRAM), registered
w/parity, 2Rx4 ECC, low voltage, memory module, based on
thirty-six 1G x 4-bit FBGA components. The SPD is pro-
grammed to JEDEC standard latency DDR3-1600 timing of
11-11-11 at 1.35V or 1.5V. This 240-pin DIMM uses gold
contact fingers. The electrical and mechanical specifications
are as follows:
FEATURES
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• On-DIMM thermal sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
11 cycles
48.125ns (min.)
260ns (min.)
35ns (min.)
(1.35V) = 5.503 W*
94 V - 0
0^o C to 85^o C
-55^o C to +100^o C
*Power will vary depending on the SDRAM.
SDRAM SUPPORTED
Kingston F-Die
Continued >>
Document No. VALUERAM1373-001.B00 10/09/14 Page 1