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KVR16LE11K3-24I Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – 24GB (8GB 2Rx8 1G x 72-Bit x 3 pcs.) | |||
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Memory Module Speciï¬cations
KVR16LE11K3/24I
24GB (8GB 2Rx8 1G x 72-Bit x 3 pcs.)
PC3L-12800 CL11 240-Pin ECC DIMM Kit
DESCRIPTION
ValueRAM's KVR16LE11K3/24I is a kit of three 1G x 72-bit
(8GB) DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 2Rx8,
ECC, low voltage, Intel® Compatibility Tested, memory mod-
ules, based on eighteen 512M x 8-bit FBGA components per
module. Total kit capacity is 24GB. The SPDs are programmed
to JEDEC standard latency DDR3-1600 timing of 11-11-11 at
1.35V or 1.5V. Each 240-pin DIMM uses gold contact fingers.
The electrical and mechanical specifications are as follows:
FEATURES
⢠JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
⢠VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
⢠800MHz fCK for 1600Mb/sec/pin
⢠8 independent internal bank
⢠Programmable CAS Latency: 11, 10, 9, 8, 7, 6
⢠Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
⢠8-bit pre-fetch
⢠Burst Length: 8 (Interleave without any limit, sequential with
starting address â000â only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
⢠Bi-directional Differential Data Strobe
⢠Thermal Sensor Grade B
⢠Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
⢠On Die Termination using ODT pin
⢠Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
⢠Asynchronous Reset
⢠PCB: Height 1.18â (30mm), double sided component
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
(Per module)
UL Rating
Operating Temperature
Storage Temperature
11 cycles
48.125ns (min.)
260ns (min.)
35ns (min.)
(1.35V) = 2.041 W*
94 V - 0
0o C to 85o C
-55o C to +100o C
*Power will vary depending on the SDRAM.
Continued >>
Document No. VALUERAM1418-001.A00 03/05/14 Page 1
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