KVR13LS9S6-2 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – 2GB 1Rx16 256M x 64-Bit PC3L-10600

Memory Module Specifications
KVR13LS9S6/2
2GB 1Rx16 256M x 64-Bit PC3L-10600
CL9 204-Pin SODIMM
DESCRIPTION
This document describes ValueRAM's 256M x 64-bit (2GB)
DDR3L-1333 CL9 SDRAM (Synchronous DRAM) 1Rx16,
memory module, based on four 256M x 16-bit FBGA compo-
nents. The SPD is programmed to JEDEC standard latency
DDR3-1333 timing of 9-9-9 at 1.35V or 1.5V. This 204-pin
SODIMM uses gold contact fingers. The electrical and me-
chanical specifications are as follows:
FEATURES
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6, 5
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), single sided component
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.125ns (min.)
260ns (min.)
36ns (min.)
(1.35V) 0.945 W*
94 V - 0
0^o C to 85^o C
-55^o C to +100^o C
*Power will vary depending on the SDRAM used.
Continued >>
Document No. VALUERAM1422-001.A00 04/04/14 Page 1