KHX16C9T3K4-32X Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – DDR3-1600 CL9 240-Pin DIMM Kit

Memory Module Specifications
KHX16C9T3K4/32X
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
49.5ns (min.)
260ns (min.)
Row Active Time (tRASmin)
36ns (min.)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
2.460 W* (per module)
94 V - 0
0^o C to 85^o C
-55^o C to +100^o C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX16C9T3K4/32X is a kit of four 1G x 64-bit (8GB)
DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory
modules, based on sixteen 512M x 8-bit DDR3 FBGA compo-
nents per module. Each module kit supports Intel^® XMP
(Extreme Memory Profiles). Total kit capacity is 32GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 9-9-9 at 1.5V. The SPDs are programmed to
JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
XMP TIMING PARAMETERS
• JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: D3-1600 CL9-9-9 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.827” (46.41mm) w/ heatsink, double sided
component
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Document No. 4806585-001.B00 03/06/13 Page 1